Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
Northstar Enterprise + Defense announced a partnership with Owens Corning to integrate advanced materials into its AI-ready modular data centers, improving insulation, durability, and sustainability.
A report by MarketsandMarkets projects the global data center accelerator market to reach $372.68 billion by 2030, driven by demand for high-performance computing supporting AI, machine learning, and big data analytics.
Caterpillar shares reached an all-time high after reporting stronger-than-expected third-quarter results driven by surging demand for its power-generation equipment used in AI data centers.
Delta Electronics introduced its AI Data Center Microgrid Solution at Energy Taiwan 2025, featuring solid-state transformers with 98.5% efficiency and an integrated architecture designed to handle rapid load changes in AI data centers.
Emerald AI, NVIDIA, and partners have announced the Aurora AI Factory in Virginia, the first power-flexible data center designed to align AI computing with grid needs. The project aims to unlock up to 100 GW of existing grid capacity for AI infrastructure expansion.
Cisco has unveiled new AI infrastructure solutions developed with NVIDIA, including the N9100 series data center switch and a Cloud Partner-compliant reference architecture for neocloud and sovereign cloud customers. The updates also extend to enterprise and telecom sectors with new security, observability, and 6G-ready networking capabilities.
Fermi America has reached agreements with the City of Amarillo and Carson County for its planned 11-gigawatt private energy grid campus in Texas, including a 20-year water supply contract and a 10-year tax abatement plan.
Vertiv has announced new gigawatt-scale reference architectures for NVIDIA’s Omniverse DSX Blueprint, designed to accelerate AI infrastructure deployment using its prefabricated OneCore platform and digital twin simulations.
SK hynix introduced its new AIN (AI-NAND) Family of storage products at the 2025 Open Compute Project Global Summit in San Jose, designed to enhance performance, density, and bandwidth for AI workloads.
Qualcomm announced two new AI accelerator chips, the AI200 and AI250, aimed at data center inference workloads. The chips will launch in 2026 and 2027, marking the company’s latest move to compete with Nvidia and AMD in the AI hardware market.
Cisco will provide technology to power and secure G42’s large-scale AI cluster in the UAE, featuring AMD MI350X GPUs and a full-stack infrastructure designed for compliance and performance under the US–UAE AI Acceleration Partnership.
iDEAL Semiconductor announced that its SuperQ technology has achieved AEC-Q101 automotive qualification, launching its first automotive-qualified MOSFET, the iS20M028S1CQ, designed for high-reliability applications including EV powertrains and ADAS.
Advantech has announced a strategic collaboration with Edge Impulse, a Qualcomm company, to integrate Edge Impulse's AI development tools into Advantech's edge computing platforms. The partnership aims to simplify AI model creation and accelerate deployment across industries.
Michael Emil Shafik, formerly a product manager at Tesla, has joined NVIDIA as Senior Product Program Manager, where he will help lead initiatives for the DGX hardware platform, according to a press release.
Upbeat Technology and SiFive have introduced the UP201 and UP301 microcontroller family, combining dual-core RISC-V architecture with AI acceleration for ultra-low power IoT and edge applications.
Humain and Qualcomm Technologies announced a collaboration to deploy advanced AI infrastructure in Saudi Arabia, aiming to deliver global AI inferencing services through fully optimized edge-to-cloud data centers.
Green Hills Software has released safety-certified development tools for Infineon’s new PSOC Edge microcontroller family, aimed at enabling high-performance, low-power edge AI applications in robotics, smart home devices, and industrial systems.
Fermi America has signed agreements with Doosan Enerbility and Hyundai Engineering & Construction to initiate production and engineering work for four AP1000 nuclear reactors in Texas.
SuperX AI Technology Limited and Chengtian Weiye have established a joint venture, SuperX Cooltech, in Singapore to develop and deliver liquid cooling solutions for AI data centers worldwide, excluding mainland China, Hong Kong, and Macau.
B&J Industries has rebranded as Future Form Manufacturing and expanded its Sparks, Nevada facilities, tripling daily production capacity to meet growing demand from data center and medical sectors.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
