Supermicro Starts Shipping NVIDIA Vera Rubin NVL72 Racks
Supermicro is shipping NVIDIA Vera Rubin NVL72 racks with its data center infrastructure and direct liquid cooling systems.
Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
Supermicro is shipping NVIDIA Vera Rubin NVL72 racks with its data center infrastructure and direct liquid cooling systems.
NewMed Energy is using the GIX geospatial intelligence platform to process technical, environmental and regulatory data across two natural gas projects.
AI Signals tracks AI costs and usage by person, team, department, repository and business activity across multiple model providers.
FICER Technology will present optical networking products for AI data centers, backbone transmission and regional internet providers at Futurecom 2026 in São Paulo.
StarCharge received certifications from the China Quality Certification Centre and Intertek for its microgrid control and performance technology.
Tencent Cloud launched DataBuddy, a managed workbench that uses AI agents for data engineering, governance, analytics and data science.
Qualcomm Technologies introduced the Snapdragon 8 Elite Extreme Gen 6 and Snapdragon 8 Elite Gen 6 mobile platforms for premium smartphones.
Ezurio introduced three BL54LM20 products for Bluetooth LE devices, including a module with an integrated neural processing unit. Beta samples will ship in October 2026.
C&D Technologies received a Stratus Award for its energy storage technology for AI data centers. The company makes battery systems that provide standby power for high density computing environments.
GS Microelectronics and Teradyne will establish a semiconductor test and evaluation center at GSME's new Silicon Valley headquarters. The center is scheduled to open in the fourth quarter of 2026.
The global modular data center market could grow from $41 billion in 2026 to $93.6 billion by 2031, supported by cloud computing and AI infrastructure demand.
Nexstrom raised a $12 million seed round to commercialize its platform for growing single crystal 2D semiconductor materials on 12 inch wafers.
AEWIN will present two AI servers using AMD EPYC 9006 processors and two phase direct liquid cooling at Taiwan Expo USA in Dallas.
TransPak has opened a 2,318 square meter facility in Chonburi, Thailand, that provides packaging, assembly and logistics services for technology equipment.
The A.I. Awards named its 2026 finalists across categories covering industries, business operations, ethical AI and customized applications. Winners will be announced on October 13.
Host Digital began trading on NYSE American after completing its merger. Its first data center site has a lease covering 43 MW of critical IT load.
Clivet introduced a magnetic levitation compressor and liquid cooling systems for AI data centers at AI Infra Summit 2026.
Huawei Digital Power presented grid forming renewable energy, storage, charging and AI data center systems at IDEE 2026. The products include a 1000 VAC energy storage architecture and megawatt scale liquid cooling.
The Global Memory Innovation Forum will bring executives and technical experts to Shenzhen on September 23 for discussions about AI memory, storage, and semiconductor technology.
Huawei presented an AI data center solution that coordinates computing, power, energy storage and cooling to improve tokens per watt.