Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
TEASK, OneQode, and Tigasfera Greentech have announced a collaboration to create a deployable system that integrates renewable energy, waste conversion, and high-performance computing. The initiative will begin in Malaysia, combining solar microgrids, waste-to-energy systems, and AI compute infrastructure.
Imec has received the ASML EXE:5200 High-NA EUV lithography system, marking a key step toward developing sub-2nm chip technologies and advancing semiconductor research in its Leuven cleanroom.
At NVIDIA GTC 2026 in San Jose, the company unveiled the Panoramic Intelligent AI Rack, a glass-based server cabinet co-developed with Lens Technology and Yuans, designed to improve cooling efficiency and structural performance in high-density AI computing environments.
Supermicro has introduced one of the first context memory storage servers built on NVIDIA’s new BlueField-4 STX reference architecture, designed to enhance AI inference performance and energy efficiency.
Microsoft and Meta have each committed about $50 billion in new data center leases to support AI infrastructure, contributing to more than $700 billion in total future lease obligations across major cloud companies, according to Bloomberg. A related report by Dell'Oro Group shows a 57% global increase in data center capital spending in 2025, driven by AI deployments.
Nebius has signed a five-year AI infrastructure supply agreement with Meta valued at up to $27 billion, including a $12 billion capacity deployment and up to $15 billion in additional compute purchases.
NewPhotonics has introduced two new optical technologies aimed at improving AI data center connectivity: the Syncra heaterless micro-ring modulator and the NPG10240 3.2Tbps transmitter-on-chip with integrated optical signal processing.
OXMIQ Labs and AM Intelligence Labs have announced a partnership to develop one of the world’s largest renewable-powered AI compute platforms, targeting 2 gigawatts of capacity by 2030, with the first phase expected online in Noida, India, by 2027.
RadiusDC has agreed to acquire phoenixNAP’s Phoenix data center and colocation operations, with plans to expand the campus to 26 megawatts of IT capacity by 2028.
Digi Power X has launched the next phase of US Data Centers, co-founded with former Verizon CEO Hans Vestberg, to deploy modular Tier III AI data centers at scale.
Core AI Holdings and Optimus Tech have launched OptiCore Datacenters, a joint venture to build sovereign AI data centers near top U.S. research universities. The facilities will support AI and machine learning research at R1-designated institutions.
Amazon Web Services and Cerebras Systems are collaborating to deploy Cerebras CS-3 systems in AWS data centers, combining them with AWS Trainium chips to deliver the fastest AI inference speeds through Amazon Bedrock.
Pure Data Centres Group and AVK have launched a 110 MW on-site microgrid at Pure DC’s Dublin campus, marking Europe’s first large-scale microgrid designed for data centers. The system supports early-stage operations and integrates with the national grid over time.
The University of Tulsa has secured $12.6 million in federal appropriations to advance research in AI, cybersecurity, materials, and energy systems, expanding its pilot-scale facilities and industry partnerships.
Pilot Photonics has partnered with Finchetto to supply nanosecond tunable lasers for Finchetto’s fully optical passive network switch designed to boost AI and data communications efficiency.
Eoptolink Technology Inc., Ltd. has launched its 12.8T XPO optical transceiver, an industry-first liquid-cooled pluggable module designed to support high-density AI data center networks, and joined the XPO Multi-Source Agreement as a founding member.
VIAVI Solutions has introduced the TestCenter D2 1.6T Appliance to support 1.6T Ethernet network validation for AI and cloud infrastructure, offering high-capacity traffic generation and analysis tools.
Blackstone Energy Transition Partners has entered an agreement to acquire a majority stake in Advanced Cooling Technologies, a U.S. manufacturer of thermal management and energy efficiency solutions. The deal is expected to close in the second quarter of 2026.
Ampace presented its AI Continuity Infrastructure at DCW London 2026, highlighting the PU Series for handling volatile AI workloads and semi-solid LFP cell technology for improved safety and stability in data centers.
Synopsys has unveiled new software-defined hardware-assisted verification platforms aimed at improving AI chip design performance and automation, following its acquisition of Ansys.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
