Advanced Packaging Market Forecast to Reach $90.11 Billion by 2031

Oct 6, 2026
Mordor Intelligence forecasts the advanced packaging market will grow from $57.46 billion in 2026 to $90.11 billion by 2031 as demand rises for AI and high performance computing systems.

Mordor Intelligence forecasts the advanced packaging market will grow from $57.46 billion in 2026 to $90.11 billion by 2031, according to a report announced in a press release. The projection represents a compound annual growth rate of 9.42% from 2026 to 2031.

The report attributes the growth to demand for heterogeneous integration in AI accelerators and high performance computing systems. Chiplet architectures, 2.5D interposers, 3D integrated circuits, stacked dies and hybrid bonding allow manufacturers to connect logic and memory at higher densities.

Demand for smaller consumer devices is also increasing the use of fan in and fan out wafer level packaging. Government semiconductor programs in the United States, Europe and South Korea are supporting domestic packaging capacity, while Asia Pacific remains a leading region for semiconductor manufacturing and advanced packaging.

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