Drut Technologies and Ranovus Collaborate on Co-Packaged Optics for AI Clusters

May 29, 2025
Drut Technologies has partnered with Ranovus to deliver a Co-Packaged Optics solution aimed at enhancing AI, ML, and HPC computing clusters, as announced in a press release.

Drut Technologies has partnered with Ranovus to deliver a Co-Packaged Optics (CPO) solution designed to enhance AI, ML, and HPC computing clusters, announced in a press release. This collaboration integrates Ranovus's ODINĀ® CPO optical interconnect technology with Drut's 2500 series, enabling PCIe Gen 5 servers to connect directly to photonic fabrics at full x16 line speed of 32G per serdes.

The partnership aims to address the critical challenges of bandwidth, density, and power consumption in high-speed electrical interconnects. By leveraging Ranovus's technology, Drut's 2500 series offers improved performance and density while reducing power consumption and footprint. This solution is expected to meet the growing demand for efficient, high-density, and scalable interconnect solutions in modern data centers.

The collaboration underscores the commitment of both companies to revolutionize data center infrastructure, providing next-generation networking solutions that cater to the evolving needs of AI and hyperscale infrastructure.

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