Finastra Hosts First Innovating Finance Together Summit in London
Finastra held its inaugural Innovating Finance Together Summit in London, bringing together more than 200 financial services professionals to discuss modernization, data interoperability, and the practical use of AI across lending, trade, and payments. The event was announced in a press release.
Topics included the transition to microservices architectures in payments, greater connectivity across lending and trade ecosystems, and innovation through tokenization and private credit markets. Finastra CEO Chris Walters emphasized the importance of collaboration in driving efficiency and improving client outcomes.
The summit featured keynotes and discussions on how financial institutions can modernize operations and adopt new technologies. Following the London event, Finastra plans to host additional summits in other regions worldwide.
We hope you enjoyed this article
Consider subscribing to one of our newsletters like Finance AI Weekly or Daily AI Brief.
Also, consider following us on social media:
More from Finance
Oct 16 Intuit Agrees to Acquire AI Billing Startup Sequence for Reported $200 Million Oct 16 Matters Raises $5 Million to Build AI Consumer Bank Oct 16 HKMA Introduces ART Framework for AI Use in Banking Oct 15 Moomoo Adds AI Assistants to Global Paper Trading Contest Oct 15 Financial Stability Board Publishes 12 AI Practices for Financial FirmsFinance AI Weekly
Weekly newsletter about AI in finance. Covers AI-driven trading, fintech innovations, and data analytics transforming markets
Whitepaper
Tensordyne Napier: What If One Rack Could Do the Work of Nine?
Tensordyne
This Tensordyne whitepaper presents Napier, an inference-focused AI processor and rack-scale system based on the company’s TDN Math logarithmic number system. It examines infrastructure requirements for large mixture-of-experts and agentic models, compares major inference architecture approaches, and details the TDN AIP processor, TDN72 pod, TDN Link fabric, and Napier Ultra configuration. The paper reports simulation-based performance, cost, and accuracy-validation results, including Tensordyne’s projected comparison of one Napier rack with a nine-rack Nvidia Rubin plus Groq deployment; the chip is reported as taped out and in fabrication.
Read moreYou may also like
Finastra Launches AI Tool for Payment Exception Repair
FIS Launches Agentic AI Suite for CFOs
AI in Finance Summit Fall Set for October 21 and 22
Abu Dhabi Finance Week Adds AI Capital Summit for 2026
Faye Expands AI Consulting Across Claude, Fin and ElevenLabs
Daily AI Brief: the AI news that matters, in your inbox.