Hexaware Technologies Introduces Zero Vulnerability for Cybersecurity Remediation
Hexaware Technologies announced in a press release Zero Vulnerability, a cybersecurity offering for enterprises managing vulnerability remediation as AI tools surface more findings. The service is designed to help teams validate findings, prioritize risk, route issues to the right owners, fix them, and confirm removal in production.
Zero Vulnerability is delivered through Zerovity, Hexaware's AI led delivery layer. The service supports custom applications, SaaS and PaaS environments, third party software, and operating systems, while working with existing security and workflow tools.
Hexaware said the service supports the remediation lifecycle from ingestion and validation through prioritization, routing, fixing, verification, and closure. The company cited the Verizon 2026 Data Breach Investigations Report, which found that 26% of critical exploited vulnerabilities were fully remediated last year, down from 38%, while median resolution time rose from 32 to 43 days.
The company also said its own evaluation across four detection lanes on production codebases consolidated 334 findings, with 14 verified as real. A developer validated review of 262 findings identified an authentication bypass weakness that pattern based rules had missed.
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Whitepaper
Tensordyne Napier: What If One Rack Could Do the Work of Nine?
Tensordyne
This Tensordyne whitepaper presents Napier, an inference-focused AI processor and rack-scale system based on the company’s TDN Math logarithmic number system. It examines infrastructure requirements for large mixture-of-experts and agentic models, compares major inference architecture approaches, and details the TDN AIP processor, TDN72 pod, TDN Link fabric, and Napier Ultra configuration. The paper reports simulation-based performance, cost, and accuracy-validation results, including Tensordyne’s projected comparison of one Napier rack with a nine-rack Nvidia Rubin plus Groq deployment; the chip is reported as taped out and in fabrication.
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