Lam Research Unveils VECTOR TEOS 3D for Advanced Chip Packaging

Lam Research Corp has introduced VECTOR TEOS 3D, a new deposition tool engineered to address critical challenges in advanced chip packaging, announced in a press release. This tool is specifically designed for next-generation chips used in artificial intelligence (AI) and high-performance computing (HPC) applications.

VECTOR TEOS 3D is capable of depositing ultra-thick, uniform inter-die gapfill films, which are essential for 3D stacking and high-density heterogeneous integration. The tool leverages a proprietary bowed wafer handling approach and innovations in dielectric deposition, supported by Lam Equipment Intelligence technology. This ensures precise and reliable handling of high-bow wafers, depositing dielectric films up to 60 microns thick, with scalability to over 100 microns.

The tool also features a unique quad station module (QSM) architecture, enhancing productivity by enabling parallel processing and reducing bottlenecks. This design results in nearly 70% faster throughput and up to 20% improvement in cost of ownership compared to previous solutions. Additionally, VECTOR TEOS 3D incorporates energy-efficient RF generators and ECO Mode peripheral control to reduce energy consumption while maintaining process precision.