Lenovo to Integrate Frore Systems AirJet Mini Cooling Chip in Future Devices

May 28, 2026
Lenovo will incorporate Frore Systems' AirJet Mini solid-state cooling chip in upcoming products through a collaboration under Lenovo's Innovation Accelerator program. The AirJet Mini G2 replaces traditional fans and heatsinks, enabling more compact and silent device designs.

Lenovo will feature the AirJet Mini solid state active cooling chip from Frore Systems in future products, announced in a press release. The collaboration takes place through Lenovo's Innovation Accelerator program.

The AirJet Mini G2 is Frore Systems' most powerful chip to date and replaces conventional fans and heatsinks with a compact solid state design that removes 7.5 watts of heat. It uses high velocity pulsating air jets to efficiently eject heat from small enclosures, allowing for thinner, lighter, and quieter devices that are also resistant to dust and water.

According to the announcement, the AirJet Mini G2 enables processors to maintain higher performance levels without throttling. The chip has received multiple industry awards, including recognition at COMPUTEX and CES. Frore Systems is scheduled to showcase the technology at Lenovo's Innovation Accelerator during The Beyond Expo from May 27 to 30, 2026.

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