Morse Micro Secures $59 Million to Expand IoT Connectivity

Morse Micro has successfully closed a $59 million Series C funding round, led by MegaChips Corporation, announced in a press release. This funding brings the company's total capital to over $193 million and will be used to accelerate the global expansion of its Wi-Fi HaLow silicon solutions.

The investment will support Morse Micro's efforts to scale production of its Wi-Fi HaLow chips and facilitate the transition to IoT 2.0, a new phase of the Internet of Things characterized by high-throughput, long-range, and scalable connectivity. The company is also launching the HaLowLink 2, a next-generation evaluation platform, and has achieved mass production with leading OEMs.

Morse Micro's CEO, Michael De Nil, emphasized the importance of this funding in positioning the company as a leader in wireless IoT chip technology. The company aims to enhance its presence in international markets and continue its role in driving the global shift from proof-of-concept IoT to full-scale industrial and consumer deployments.