NewPhotonics Unveils Heaterless Micro-Ring Modulator and 3.2Tbps Transmitter-on-Chip for AI Data Centers

Tel Aviv-based NewPhotonics has announced two new photonic integration technologies designed to enhance AI data center performance. The company introduced its Syncra micro-ring modulators (MRM), which use Niox zero-loss monitoring and real-time calibration technology to maintain thermal stability without heaters or monitoring photodiodes. This approach eliminates thermal crosstalk and reduces energy consumption, supporting compact and scalable co-packaged optics (CPO) designs.

Syncra’s heaterless design is implemented on standard silicon photonics processes without requiring modifications to process development kits. The Niox technology enables wavelength calibration in real time, allowing the modulators to operate efficiently across temperature variations. NewPhotonics demonstrated these technologies during the OFC 2026 conference in Los Angeles.

Earlier in the same week, the company announced its NPG10240 3.2Tbps transmitter-on-chip, a photonic integrated circuit featuring integrated lasers, high-speed modulators, and an optical signal processor called OSPic. The flip-chip design supports 448Gbps per lane and reduces RF design constraints by handling signal equalization in the optical domain. Sampling for the 3.2Tbps transmitter is expected to begin in the fourth quarter of 2026.