Salute Launches Direct-to-Chip Liquid Cooling Operations Service for AI Data Centers
Salute has launched what it calls the data center industry's first comprehensive service for Direct-to-Chip (DTC) liquid cooling operations, introduced at NVIDIA GTC Washington DC, announced in a press release. The service is designed to support artificial intelligence (AI) and high-performance computing (HPC) facilities that require efficient heat management for high-density computing workloads.
The company’s DTC operational model aims to help data center operators manage the elevated risks associated with liquid cooling, including leaks, temperature spikes, and downtime. Salute’s service includes design and operational assessments that create facility-specific operational models for safe and reliable DTC liquid cooling.
Several major operators, including Applied Digital, Compass Datacenters, and SDC, have already adopted Salute as their partner for DTC liquid operations. By integrating this service, these companies aim to ensure operational continuity and protect their AI infrastructure investments.
We hope you enjoyed this article
Consider subscribing to one of our newsletters like Silicon Brief or Daily AI Brief.
Also, consider following us on social media:
More from Data Centers
Oct 16 EverWind Plans 420 Megawatt AI Data Centre in Nova Scotia Oct 16 Gartner Says $3.5 Trillion in AI Infrastructure Spending Faces Impairment Risk by 2030 Oct 16 KBRA Rated Anthropic BB+ Before $35 Billion Chip Financing Oct 16 China Proposes Export Controls for Advanced AI Models and Chips Oct 16 Hitachi Energy and Ansaldo Energia Partner on Data Center Power SystemsSilicon Brief
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
Whitepaper
Tensordyne Napier: What If One Rack Could Do the Work of Nine?
Tensordyne
This Tensordyne whitepaper presents Napier, an inference-focused AI processor and rack-scale system based on the company’s TDN Math logarithmic number system. It examines infrastructure requirements for large mixture-of-experts and agentic models, compares major inference architecture approaches, and details the TDN AIP processor, TDN72 pod, TDN Link fabric, and Napier Ultra configuration. The paper reports simulation-based performance, cost, and accuracy-validation results, including Tensordyne’s projected comparison of one Napier rack with a nine-rack Nvidia Rubin plus Groq deployment; the chip is reported as taped out and in fabrication.
Read moreYou may also like
Castrol Launches CORE Cooling Service for AI Data Centers
Delta Develops Power and Cooling Infrastructure for NVIDIA DSX AI Factories
Old World Industries and Integrity Systems Partner on Data Center Coolant Monitoring
Compal to Show NVIDIA AI Factory Infrastructure at OCP Summit
Clivet Debuts Magnetic Levitation Cooling Portfolio for AI Data Centers
Daily AI Brief: the AI news that matters, in your inbox.