Supermicro Expands OCP Portfolio for AI Data Centers

Oct 13, 2026
Supermicro expanded its Open Compute Project portfolio with rack scale systems, centralized power, liquid cooling, networking and management software for AI data centers.

Supermicro announced in a press release an expanded portfolio of Open Compute Project Accepted systems, racks and rear door heat exchangers, using designs from the Open Compute Project Foundation. The products can be combined into complete rack and cluster scale AI deployments through its Data Center Building Block Solutions.

The ORv3 and ORW racks replace per server power supplies and cables with a centralized 48V DC busbar. Supermicro's DLC-2 direct to chip liquid cooling removes heat from CPUs and GPUs, while rear door heat exchangers rated from 10 kW to 120 kW remove residual heat without retrofitting data hall air conditioning. The line also includes a 250 kW in rack coolant distribution unit and 2 OU NVIDIA HGX B300 nodes that fit up to 144 GPUs in a rack.

The portfolio includes air and liquid cooled 800G and 1.6T Ethernet switches, among them co-packaged optics platforms built on Broadcom Tomahawk 6, and Supermicro says operators can manage all of its components through its SuperCloud Composer software.

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