SuperX and Chengtian Weiye Form Joint Venture for AI Liquid Cooling Solutions
SuperX has entered into a definitive agreement with Chengtian Weiye to establish a joint venture, SuperX Cooltech Pte. Ltd., in Singapore, announced in a press release. SuperX will be the largest shareholder, and the new company will focus on providing liquid cooling products and infrastructure solutions for global markets outside mainland China, Hong Kong, and Macau.
The joint venture combines SuperX’s expertise in AI system integration with Chengtian Weiye’s thermal management and manufacturing capabilities. SuperX Cooltech will offer a full range of liquid cooling technologies, including Cooling Distribution Units (CDUs), Micro Channel Liquid Cold Plates (MCLP), and integrated thermal management systems.
According to the companies, the partnership will enable SuperX to deliver complete liquid-cooled AI server solutions, integrate hardware and software for optimized performance, and expand global production capacity. The venture aims to address the increasing power and heat management requirements of high-density AI and high-performance computing environments driven by next-generation GPU architectures.
We hope you enjoyed this article
Consider subscribing to one of our newsletters like Silicon Brief or Daily AI Brief.
Also, consider following us on social media:
More from Data Centers
Oct 16 EverWind Plans 420 Megawatt AI Data Centre in Nova Scotia Oct 16 Gartner Says $3.5 Trillion in AI Infrastructure Spending Faces Impairment Risk by 2030 Oct 16 KBRA Rated Anthropic BB+ Before $35 Billion Chip Financing Oct 16 China Proposes Export Controls for Advanced AI Models and Chips Oct 16 Hitachi Energy and Ansaldo Energia Partner on Data Center Power SystemsSilicon Brief
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
Whitepaper
Tensordyne Napier: What If One Rack Could Do the Work of Nine?
Tensordyne
This Tensordyne whitepaper presents Napier, an inference-focused AI processor and rack-scale system based on the company’s TDN Math logarithmic number system. It examines infrastructure requirements for large mixture-of-experts and agentic models, compares major inference architecture approaches, and details the TDN AIP processor, TDN72 pod, TDN Link fabric, and Napier Ultra configuration. The paper reports simulation-based performance, cost, and accuracy-validation results, including Tensordyne’s projected comparison of one Napier rack with a nine-rack Nvidia Rubin plus Groq deployment; the chip is reported as taped out and in fabrication.
Read moreYou may also like
SuperX Adds Model as a Service to Singapore AI Centre
SuperX Launches AI Token Platform and Content Creation Apps
Old World Industries and Integrity Systems Partner on Data Center Coolant Monitoring
Clivet Unveils Magnetic Bearing Compressor for AI Data Center Cooling
SUNON to Show Liquid Cooling Systems for AI Computing at OCP Summit
Daily AI Brief: the AI news that matters, in your inbox.