SuperX Signs MOU to Develop Modular AI Data Centers in Japan

SuperX Industries Co., Ltd. has signed a Memorandum of Understanding with Digital Dynamic Inc., eole Inc., and Woodman Inc. to co-develop large-scale AI data centers in Japan, announced in a press release.

The agreement, signed on February 4, 2026, follows an earlier MOU in Osaka and establishes a joint framework for developing modular AI data centers across the country. The partners plan to launch a pilot project in Mie Prefecture with an initial capacity of up to 4MW, subject to feasibility studies and regulatory approvals.

The pilot facility will feature modular architecture designed to accelerate deployment and support next-generation, liquid-cooled GPUs. The collaboration will focus on integrating advanced power systems and liquid cooling solutions to sustain continuous AI workloads.

The framework also includes plans to explore the integration of renewable energy components such as solar and wind power, along with energy storage and grid interconnection. A joint task force will define technical architecture, governance, and milestones, with SuperX leading system architecture and power integration. The pilot will serve as a reference for potential expansion to 300MW of total capacity across Japan.