Vidu Integrates AI Video Tech into Honor 400 Series

Jun 9, 2025
Vidu, a product of ShengShu Technology, has partnered with Honor to integrate its AI video technology into the Honor 400 Series smartphones, enabling cinematic video creation on consumer devices.

Shengshu AI has announced a strategic partnership with Honor to integrate its advanced image-to-video AI technology into the Honor 400 Series smartphones. Announced in a press release, this collaboration allows users to transform static images into cinematic videos directly on their devices, marking a significant step in mobile video production.

The Honor 400 Series, launched on May 28, 2025, now features Vidu's multimodal Image-to-Video AI, which enables professional-grade video generation. This integration is designed to overcome traditional computational limits, allowing smartphones to function as creative hubs for video production.

In addition to the smartphone integration, Vidu has also secured a landmark IP deal with the 1999 Journey to the West anime. This partnership allows users to creatively reinterpret the iconic Monkey King character, applying the anime's art style to personal photos and generating personalized video segments.

These initiatives are part of Vidu's broader strategy to redefine creative production and expand its proprietary IP catalog, positioning generative platforms as engines for cultural IP origination.

We hope you enjoyed this article

Consider subscribing to one of our newsletters like Daily AI Brief.

Also, consider following us on social media:

AI Brief AI Brief (X)
Free newsletter

Daily AI Brief

Daily report covering major AI developments and industry news, with both top stories and complete market updates

AI Token Webinar

Whitepaper

Tensordyne Napier: What If One Rack Could Do the Work of Nine?

Tensordyne

This Tensordyne whitepaper presents Napier, an inference-focused AI processor and rack-scale system based on the company’s TDN Math logarithmic number system. It examines infrastructure requirements for large mixture-of-experts and agentic models, compares major inference architecture approaches, and details the TDN AIP processor, TDN72 pod, TDN Link fabric, and Napier Ultra configuration. The paper reports simulation-based performance, cost, and accuracy-validation results, including Tensordyne’s projected comparison of one Napier rack with a nine-rack Nvidia Rubin plus Groq deployment; the chip is reported as taped out and in fabrication.

Read more

You may also like

Free, six days a week

Daily AI Brief: the AI news that matters, in your inbox.