Wiwynn adds AMD, cooling and optical systems to OCP showcase

Wiwynn expands its 2026 OCP Global Summit AI infrastructure showcase with an AMD Helios rack, new cooling designs and a co packaged optics system, the company said in a press release.

The Helios system combines AMD Instinct MI450 Series GPUs, EPYC server CPUs, Pensando networking and ROCm software in an Open Rack Wide design. Wiwynn and Wistron are also pilot build partners for the liquid cooled NVIDIA Vera Rubin NVL72 platform, which integrates 72 Rubin GPUs and 36 Vera CPUs.

Wiwynn's cooling exhibits include direct diamond to silicon microchannels and a double sided cold plate with 6 kW of cooling capacity. The company says the cold plate improves thermal performance by more than 15% and can reduce power delivery loss by up to 80%. Other designs cut cooling component weight by at least 30% and tailor microchannels to chip heat maps.

The co packaged optics rack system covers fiber routing, patch panels and fiber management across products from multiple vendors. Wiwynn developed the demonstration with Ayar Labs, Corning, GUC and Senko.