Stay up to date with the latest developments in artificial intelligence.
ASUS unveiled its AI Factory and XA NB3I-E12 AI servers powered by NVIDIA HGX B300 systems at the 2025 OCP Global Summit, highlighting solutions for enterprise and cloud AI workloads.
GIGABYTE has announced that its AI TOP ATOM personal supercomputer, featuring the NVIDIA Grace Blackwell GB10 Superchip, will be available globally from October 15. The compact system delivers up to 1 PetaFLOP of FP4 AI performance and supports models with up to 200 billion parameters.
Ericsson and Vodafone have announced a five-year partnership to modernize Vodafone’s network infrastructure across several key markets using Ericsson’s programmable and AI-powered network solutions.
NetU.ai has appointed Michael Nail as Chief Business Officer to lead growth of its networking and monetization platform for businesses and organizers.
Wiwynn introduced a double-wide rack architecture at the OCP Global Summit 2025 to support larger, high-power AI accelerators with integrated HVDC power and advanced liquid cooling systems.
Compal Electronics presented new CXL-based memory pooling and liquid cooling server technologies at the 2025 OCP Global Summit, highlighting its collaboration with NVIDIA and focus on scalable AI data center infrastructure.
Barron Venture Partners, a new venture capital firm led by Andrew Worden, has launched its first fund to support early-stage companies working on transformative technologies across North America, the UK, and Europe.
Recognize has made a strategic investment in Security Risk Advisors, marking the firm's first institutional equity funding. The partnership aims to accelerate SRA's advisory, managed security, and software offerings across its global operations.
Irys has secured $12.5 million in seed funding led by Markd, with Deepwork Capital, Florida Opportunity Fund, and others participating, to scale its AI-native insurance operating system across the U.S. and Canada.
FADEL has unveiled new AI-powered automation capabilities built on AWS Bedrock, designed to enhance licensing and marketing workflows through adaptive, autonomous agents.
Acbel introduced its Ruby-level power rack system at the OCP Global Summit 2025 in San Jose, offering scalable and resilient power solutions for hyperscale AI and HPC workloads.
Fabric8Labs and Wiwynn will present advanced Electrochemical Additive Manufacturing (ECAM) cold plate solutions for AI data center cooling at the OCP Global Summit 2025 in San Jose.
Planera has raised $8 million in new funding to expand its visual scheduling platform for data center construction, bringing total funding to $26.5 million.
DarioHealth Corp. has added six new employer clients across sectors such as manufacturing and education, representing tens of thousands of employees, and introduced a new value-based pricing model linking payments to engagement and clinical outcomes.
Oracle and Duality Technologies have partnered to make Duality’s secure data collaboration platform available on Oracle Cloud Infrastructure, enabling confidential AI and analytics for government and defense organizations.
Glide Identity has secured over $20 million in Series A funding led by Crosspoint Capital Partners, with participation from Amigos Venture Capital, Singtel Innov8 Ventures, and Sir Ronald Cohen, to expand its SIM-based cryptographic authentication platform for the AI era.
Flex announced a globally manufactured, fully integrated data center platform at the OCP Global Summit, designed to accelerate AI and high-performance computing infrastructure deployments by up to 30%.
Coveo has been recognized by Amazon Web Services with the Generative AI Competency, highlighting its expertise in delivering enterprise-grade generative AI solutions. The designation acknowledges Coveo’s technical proficiency and customer success in deploying scalable generative AI systems using AWS technologies.
Da Vinci Capital portfolio company Noventiq has secured an equity investment from Niobrara Capital to support growth and international expansion. The investment follows previous financing rounds involving Da Vinci Capital and other institutional investors.
InPsytech presented its 3nm UCIe 3.0 high-speed interface technology at the OCP Global Summit 2025 in San Jose, demonstrating support for 3D packaging and collaboration with Alcor Micro on an Arm-based CPU platform.
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