Oct 14, 2026
UfiSpace demonstrates liquid cooling for 1.6T AI networking
UfiSpace is demonstrating a liquid cooled 102.4 Tbps networking platform with 64 ports supporting 1.6T connectivity at the 2026 OCP Global Summit.
Chips & Data Centers
Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
Oct 15
Huawei Proposes AI Data Center Focused Network Architecture
Oct 15
Huawei Proposes Next Generation OTN for AI Data Center Networks
Oct 15
Senators Question Meta Tax Credits for AI Data Centers
Oct 15
Sachin Katti to Leave OpenAI Infrastructure Role
Oct 14, 2026
Pegatron showcases NVIDIA Vera Rubin AI racks at OCP Summit
Pegatron is presenting liquid cooled AI infrastructure based on NVIDIA Vera Rubin at the OCP Global Summit 2026. Its systems range from rack scale GPU platforms to compute and storage servers.
Oct 14, 2026
Hyperscale Data Plans $33.5 Million Tokenized Preferred Stock Offering
Hyperscale Data plans to tokenize up to 1.34 million Series D preferred shares in a proposed offering that could raise $33.5 million for its Michigan AI data center campus.
Oct 14, 2026
TIA Releases Draft DCE 9000 Data Center Quality Standard
TIA released the first draft of DCE 9000, a certifiable quality management standard for data center operators, suppliers and contractors. The final standard is planned for the first quarter of 2027.
Oct 14, 2026
CyberTAN unveils 102.4 Tbps liquid cooled Ethernet switch blueprint
CyberTAN has introduced its Pallas Series switch platform blueprint, which combines Marvell Teralynx T100 silicon with direct chip liquid cooling for AI data centers.
Oct 14, 2026
Great Lakes Semiconductor Starts ChipForge Vehicle Sensor Project
Great Lakes Semiconductor has started the first project on its Great American ChipForge platform, focused on intelligent sensors for vehicle applications.
Oct 14, 2026
Altair Integrates Iridium Satellite Connectivity Into IoT Chipsets
Altair Semiconductor is integrating Iridium NTN Direct into its ALT1350 and ALT1550 chipsets, combining cellular and satellite IoT connectivity without a separate satellite modem.
Oct 14, 2026
QuickLogic secures eFPGA contract for automotive and industrial SoC
QuickLogic secured a six figure contract to supply embedded FPGA intellectual property for an SoC targeting battery management, motor control and industrial robotics.
Oct 14, 2026
Solidion Says PEAK UPS Can Cut Battery Footprint by 30%
Solidion says its PEAK battery system for AI data centers can reduce the footprint of uninterruptible power supplies by up to 30%. The system uses the company's silicon carbon 5500 cell.
Oct 14, 2026
LITEON Shows 800 VDC Power and Cooling Systems for NVIDIA Vera Rubin
LITEON Technology is displaying 800 VDC power distribution and liquid cooling systems for NVIDIA Vera Rubin and OCP ORv3 infrastructure at the 2026 OCP Global Summit.
Oct 14, 2026
SmartSens Shows Automotive Vision Sensors at AutoSens Europe
SmartSens presented image sensors and computing systems for vehicle cameras, driver monitoring, occupant monitoring and surround view applications at AutoSens Europe 2026.
Oct 14, 2026
Delta Debuts DC Power System for AI Data Centers
Delta Electronics introduced a prefabricated DC power system that combines solid state transformers, DC/DC converters and control equipment for AI data centers.
Oct 14, 2026
IDC Raises 2029 OCP Infrastructure Spending Forecast to $800 Billion
IDC projects annual spending on infrastructure recognized by the Open Compute Project will reach $800 billion in 2029 and $892 billion in 2030.
Oct 14, 2026
Vertiv Releases Enterprise AI Infrastructure Guide
Vertiv released a guide that helps enterprises match AI workloads with deployment locations and physical infrastructure. The framework covers facility readiness, infrastructure models, and reference designs.
Oct 14, 2026
Lovelace Brings Elemental Core to Google Cloud Marketplace
Lovelace makes Elemental Core available through Google Cloud Marketplace for deployment within customer cloud environments.
Oct 14, 2026
SEMI Projects 300mm Fab Equipment Spending to Reach $227 Billion in 2029
Global spending on equipment for 300mm chip fabs is projected to rise 31% to $149 billion in 2026 and reach $227 billion in 2029, according to SEMI.
Oct 14, 2026
xFusion Showcases Liquid Cooling and 800V Power Systems at OCP 2026
xFusion presents liquid cooled racks, an 800V power prototype and a super node architecture for dense AI infrastructure at OCP 2026.
Oct 14, 2026
Data Center Infrastructure Market Reaches $14 Billion as AI Demand Grows
Global data center physical infrastructure revenue rose 27% year over year to $14 billion in the second quarter of 2026, supported by demand for AI capacity.
Oct 14, 2026
3C and Datalec merge to form $400 million data center services company
3C and Datalec Precision Installations have merged to create a data center infrastructure company with expected 2026 revenue above $400 million.
Oct 14, 2026
DayOne expands Malaysia financing to US$7.2 billion
DayOne Data Centers increased its Malaysia financing to about US$7.2 billion for its Johor data center platform. Customer contracts now generate income from more than 1GW of capacity.
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Silicon Brief
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
