Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
Wesco International has signed an agreement to acquire Newark Engineering Group, a Singapore-based provider of data center cooling and lifecycle services, for about $136 million USD. The deal expands Wesco's presence in Southeast Asia and strengthens its data center service portfolio.
Innodisk showcased its full Qualcomm Dragonwing edge AI lineup at Computex 2026, introducing modules, starter kits, and deployment-ready systems powered by Dragonwing IQ8 through IQ10 processors.
Solidion Technology has received seven new U.S. patents for its composite anode materials used in lithium batteries, expanding its portfolio to 130 patents. The technology aims to improve energy density and lower costs for applications in AI data centers, humanoid robots, drones, electric vehicles, and space systems.
EPAM Systems and TGS have deployed the TGS Imaging AnyWare platform on Amazon Web Services to modernize seismic imaging workflows and enable AI-driven subsurface data operations for energy companies.
Hitachi and Intel have announced a strategic collaboration to advance physical AI, quantum computing, and digital infrastructure across key industries including manufacturing, energy, and mobility.
USD.AI has provided $98.1 million in asset-backed debt financing to support Duos Edge AI’s deployment of 2,304 NVIDIA B300 GPUs, which will be managed by Hydra Host through its Brokkr AI Factory Operating System.
ROHM Semiconductor announced that its 750V SiC MOSFET has been adopted in battery backup units for AI server power supplies, supporting the industry's shift toward high-voltage direct current architectures.
CHG EnSOL introduced its ENSOL-AIDC photovoltaic modules at the SNEC 2026 conference in Shanghai, designed to supply clean energy to AI data centers. The company also announced a partnership with Suzhou Heimian Optoelectronics to develop perovskite-silicon tandem solar cells for space applications.
Solidion Technology has introduced a patented battery platform designed for satellites, AI data centers in Low Earth Orbit, and future lunar missions. The system uses graphene to manage temperature and radiation exposure, ensuring reliable operation from minus 80 to plus 60 degrees Celsius.
REPT BATTERO introduced two new energy storage battery cells at the SNEC 2026 exhibition in Shanghai: a 320 Ah sodium-ion cell for large-scale energy storage and an 85 Ah lithium-ion battery designed for AI data centers.
Hut 8 has priced a $4.25 billion offering of senior secured notes to fund construction of a 352-megawatt data center in Nueces County, Texas. The notes, bearing interest at 6.129% and maturing in 2042, will finance the Beacon Point facility and related infrastructure.
ASRock Rack unveiled its new AI infrastructure lineup at COMPUTEX 2026, featuring the 2UXGM-VERA2 system powered by the NVIDIA Vera CPU and showcasing liquid-cooled AI servers for data centers and edge deployments.
GMI Cloud announced at NVIDIA GTC 2026 in Taipei that it is supporting the NVIDIA Vera Rubin platform to power the next generation of agentic AI factories, offering secure, high-performance infrastructure for large-scale inference and multimodal AI workloads.
Autodesk has entered a strategic collaboration agreement with Amazon Web Services to expand cloud-based design and make solutions, with Autodesk products soon available through AWS Marketplace.
Wiwynn and Shinwa Controls have formed a strategic collaboration to deliver liquid cooling infrastructure for data centers, following three years of joint engineering and validation work.
HCM, a Taiwan-based manufacturer of lithium manganese iron phosphate cathode materials, was invited to the Choose France Summit at Versailles, marking its first participation and signaling growing collaboration between Taiwan and France in energy, defense, and aerospace sectors.
Perplexity AI unveiled a hybrid inference system that autonomously decides which AI tasks run locally and which are processed in the cloud, debuting the technology at Computex 2026 alongside Intel.
Rivvor announced progress on its sub-THz wireless interconnect platform designed to replace short-range cabling in high-density AI data centers. The technology achieved multi-Gbps data transfer and nanosecond-scale latency in lab tests, with production silicon targeted for 2028.
Lovable has expanded its partnership with Google Cloud to integrate Gemini models and AI infrastructure, enabling large scale software creation and improved enterprise security.
Anyscale has announced the public preview of Anyscale on Azure, a native integration that enables enterprises to build and operate AI systems entirely within their own Microsoft Azure environment, with reported cost savings of up to 90%.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
