Chips & Data Centers

Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.

Born.ai Offers Distributed Compute Patent Portfolio for License or Sale

Born.ai, operating under EYWA LLC, announced the availability of its distributed computing patent portfolio for immediate license or acquisition. The assets cover technologies enabling large-scale AI workloads across federated networks of independent nodes.

February 06, 2026

LG Electronics and Midea Highlight Advanced HVAC and Cooling Systems at AHR Expo 2026

At the AHR Expo 2026 in Las Vegas, LG Electronics and Midea Building Technologies showcased new HVAC and cooling solutions for residential, commercial, and industrial applications, including data center cooling systems and integrated smart building platforms.

February 04, 2026

Johnson Controls Unveils Thermal Management Guides for Gigawatt-Scale AI Data Centers

Johnson Controls has introduced a Reference Design Guide Series for 1-gigawatt AI data centers, providing detailed thermal architectures for water-cooled, air-cooled, and absorption chiller systems integrated with advanced building controls.

February 04, 2026

SpaceX Acquires xAI to Build Space-Based AI Data Centers

SpaceX has acquired Elon Musk’s artificial intelligence company xAI, merging the two firms to develop orbital data centers powered by solar energy and launched via Starship.

February 03, 2026

Oracle Plans $50 Billion Financing for 2026 Cloud Infrastructure Expansion

Oracle announced plans to raise between $45 and $50 billion in 2026 through a mix of debt and equity financing to expand its Oracle Cloud Infrastructure capacity for major clients including AMD, Meta, NVIDIA, OpenAI, TikTok, and xAI.

February 02, 2026

FPT Establishes Vietnam’s First Advanced Semiconductor Testing and Packaging Plant

FPT Corporation has announced the creation of the FPT Advanced Semiconductor Testing and Packaging Plant in Bac Ninh Province, marking Vietnam’s first fully Vietnamese-owned facility of its kind. The plant will enhance the country’s semiconductor ecosystem and provide training for local engineers.

January 30, 2026

ASML Reports Record €13 Billion in New Orders as AI Demand Fuels Chip Expansion

ASML reported a record €13 billion in new orders for the fourth quarter of 2025, signaling continued strong demand for advanced chipmaking equipment driven by artificial intelligence infrastructure growth. The company posted €32.7 billion in annual net sales and announced plans to cut 1,700 jobs.

January 29, 2026

Blaize and Nokia Sign MoU to Develop Hybrid AI Solutions Across Asia-Pacific

Blaize and Nokia have signed a Memorandum of Understanding to collaborate on edge and hybrid AI inference solutions across Asia-Pacific, combining Blaize's AI platform with Nokia's networking and automation systems.

January 28, 2026

Lucend Raises $3.3M to Expand Transparent AI Platform for Data Centers

Lucend, formerly known as Coolgradient, has raised $3.3 million in seed funding led by Remarkable Ventures Climate to expand its Transparent AI platform for data center optimization in the U.S.

January 28, 2026

Ricursive Intelligence Raises $300 Million Series A for AI-Driven Chip Design

Ricursive Intelligence has raised $300 million in a Series A funding round led by Lightspeed Venture Partners, valuing the company at $4 billion. The Palo Alto-based startup, founded by Dr. Anna Goldie and Dr. Azalia Mirhoseini, aims to accelerate semiconductor design using AI.

January 28, 2026

SK hynix to Launch U.S.-Based AI Solutions Arm with $10 Billion Commitment

SK hynix announced plans to establish a U.S.-based AI solutions firm, tentatively named AI Company (AI Co.), through the restructuring of its Solidigm subsidiary, with a $10 billion capital commitment to strengthen its role in the AI data center ecosystem.

January 28, 2026

BOSGAME Launches Dual-Platform AI PCs with AMD and Intel Chips

BOSGAME has introduced two AI PC models, the VTA-439 and VTI-490, built on AMD Ryzen and Intel Core Ultra platforms, with global availability set for early 2026.

January 27, 2026

Saitech Delivers Liquid-Cooled Supermicro Server System to U.S. Army

Saitech has configured and deployed a million-dollar Supermicro liquid-cooled computing system for the U.S. Army, providing rugged, high-density performance for mission-critical operations.

January 27, 2026

NVIDIA Invests $2 Billion in CoreWeave to Expand AI Data Center Capacity

NVIDIA has invested $2 billion in CoreWeave to accelerate the AI infrastructure company's plans to build over 5 gigawatts of data center capacity by 2030. The deal nearly doubles NVIDIA's stake and strengthens their collaboration on AI computing infrastructure.

January 27, 2026

Microsoft Introduces Maia 200 AI Inference Chip Built on 3nm Process

Microsoft has launched the Maia 200, an AI inference accelerator built on TSMC’s 3-nanometer process, designed to improve performance and efficiency for large-scale AI workloads. The chip delivers up to 10 petaflops in 4-bit precision and powers models including GPT-5.2 and Microsoft Copilot.

January 27, 2026

Samsung to Begin HBM4 Chip Production for Nvidia in February

Samsung Electronics is set to start mass production of its next-generation HBM4 memory chips next month, with shipments expected to go to Nvidia after completing final qualification stages.

January 26, 2026

Intel Forecasts Weak Q1 as AI Server Chip Demand Outpaces Supply

Intel expects first-quarter revenue and profit to fall below analyst estimates as it struggles to meet demand for server chips used in AI data centers, leading to a 13% drop in its share price.

January 26, 2026

Nvidia CEO Jensen Huang Says AI Driving Largest Infrastructure Buildout in History

Nvidia CEO Jensen Huang said the global expansion of artificial intelligence is fueling what he described as the largest infrastructure buildout in human history, projecting $85 trillion in investments over the next 15 years.

January 26, 2026

Neurophos Raises $110 Million to Develop Photonic AI Chips

Austin-based Neurophos has raised $110 million in a Series A round led by Gates Frontier to develop its photonic AI chips, which use micron-scale metamaterial optical modulators to boost performance and energy efficiency.

January 22, 2026

AheadComputing Raises $30M to Advance High-Performance CPU for AI Workloads

Portland-based AheadComputing has raised $30 million in a Seed2 round led by Eclipse, Toyota Ventures, and Cambium to accelerate development of its RISC-V-based CPU architecture designed for AI applications.

January 22, 2026

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