Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
SK hynix and Sandisk have unveiled the first standard specifications for High Bandwidth Flash, a NAND based memory layer intended to sit between HBM and SSDs for AI systems.
Montage Technology has started trial production of its CXL 3.2 Memory eXpander Controller chip for AI, cloud, and data center memory expansion.
AZIO AI has signed a Master Services Agreement with AT&T to provide enterprise fiber connectivity for its first 500 megawatt AI data campus in Texas.
Cerberus Capital Management and Yondr Group have acquired a 40 acre site in Manassas, Virginia, for a planned 72 MW data center campus expected to start operations in 2029.
Teradata has made its Data Analyst Agent available in AWS Marketplace, allowing AWS customers to deploy conversational analytics in existing cloud environments.
Emerson Electric has introduced its DeltaV Automation Platform for Data Centers to manage power, cooling, and other critical infrastructure for AI scale facilities.
PJM Interconnection said 715 proposed generation projects totaling more than 200 GW have qualified for study under its reformed interconnection process.
Mousterian Corporation and Samsung Heavy Industries signed an engineering contract for their first moored floating data center deployment in the United States. The planned units will each provide 50 megawatts of critical IT capacity for AI compute.
Leidos and CoreWeave are collaborating on secure sovereign AI cloud services for the U.S. Intelligence Community and Department of War. CoreWeave will provide its AI cloud platform, while Leidos will handle mission integration and secure architecture.
SiEngine Technology secured US$200 million in equity financing in H1 2026 to support research, production expansion, globalization, and customer growth for its automotive chip business.
Xsight Labs has raised more than $300 million in a funding round that values the semiconductor company at $2.8 billion. The company plans to use the capital for its switch and DPU roadmap, hiring, manufacturing, supply chain, and customer deliveries.
Extropic has signed a letter of intent with the U.S. Department of Commerce for up to $75 million in planned CHIPS research funding to develop Thermodynamic Sampling Units and qualify a domestic manufacturing path.
Cloud Capital closed a $520 million data center asset backed securities issuance through its new ABS Master Trust, secured by an 80 MW hyperscale data center in Northern Virginia.
Equinix reported $2.625 billion in second quarter 2026 revenue, up 16% from a year earlier, and raised its full year guidance and long term outlook.
Meta reported second quarter revenue of $60.8 billion, up 28 percent from a year earlier, while net income fell 14 percent as costs and capital spending rose.
The U.S. Department of Energy announced a more than $100 billion private investment to build an AI data center campus at the former Paducah Gaseous Diffusion Plant in Kentucky, with Brookfield developing the campus and NextEra Energy building power infrastructure.
CleanCore Solutions has signed a 10 year colocation agreement with Cerebras Systems for an AI data center campus in Minnesota. The project is expected to generate about $800 million in contract value over the initial term.
Eolian has started construction on Flint Grid, a 200 MW, 1.06 GWh battery energy storage project near Columbus, Ohio, to support data center and industrial power demand.
Recursive signed a $410 million multiyear agreement with Amazon Web Services to run its automated AI research system on AWS and jointly develop infrastructure for automated AI research.
Newforma and Amazon Web Services have signed a seven year collaboration to modernize Newforma's cloud platforms and expand generative AI features for AECO customers.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
