Stäubli Combines Power and Liquid Cooling Connections for AI Data Centers

September 05, 2026
Stäubli has introduced integrated electrical power and liquid cooling connections for high density AI data centers, including systems compatible with Open Rack v3.
Stäubli Combines Power and Liquid Cooling Connections for AI Data Centers
Image: Stäubli via PR Newswire

Stäubli has introduced integrated electrical power and liquid cooling connections for high density AI data centers, the company announced in a press release. The systems include support for Open Compute Project Open Rack v3 architectures.

Its high current electrical connectors distribute power from switchgear, uninterruptible power supply systems, and power distribution units to data center racks. Stäubli also offers UQD non spill quick couplings designed in line with Open Compute Project specifications for liquid cooling.

The liquid cooling portfolio covers facility infrastructure, cooling distribution units, manifolds, servers, blades, and optical modules. Stäubli plans to attend the Open Compute Project Global Summit in San Jose from October 12 to 15, 2026, and Supercomputing in Chicago from November 15 to 20, 2026.

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