BOS Semiconductors Selects Ceva AI DSP for Next-Gen ADAS SoC

BOS Semiconductors has licensed the SensPro AI DSP architecture from Ceva, Inc. for its Eagle-A standalone automotive system-on-chip (SoC), announced in a press release.

The Eagle-A SoC combines a neural processing unit, CPU, and GPU with interfaces for camera, LiDAR, and radar fusion to support advanced driver assistance and autonomous driving systems. Ceva’s SensPro AI DSP is optimized for LiDAR and radar pre-processing, enabling efficient handling of raw sensor data and reducing latency in perception pipelines.

BOS Semiconductors’ Eagle-A uses a chiplet-based strategy that allows integration with its Eagle-N AI accelerator through UCIe and PCIe connections. This modular approach supports scalable compute performance for different ADAS and autonomous driving requirements. The company also noted that the Eagle series architecture can be deployed in edge AI applications such as robotics and drones.

According to BOS Semiconductors, the SensPro AI DSP contributes to achieving its design goals for performance, safety, and scalability in ADAS applications, enabling real-time data integration from multiple sensors for accurate vehicle perception.