Spirox Launches SP7000G Glass Substrate Inspection System
Spirox announced in a press release the SP7000G High Speed TGV Crack Inspection System at the Advanced Packaging Technology Forum in Hsinchu on September 8.
The system scans a full 510 mm by 515 mm glass substrate in under 20 minutes. It detects internal microcracks after metallization and ABF build up processes, while tracking process quality and defect distribution.
The SP7000G provides nondestructive inspection and analysis of through glass vias for research, quality control, and volume manufacturing. It complements the company’s SP8000G inspection system.
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