NVIDIA Expands Chip Packaging and Testing Capacity

Oct 21, 2026
NVIDIA is expanding substrate, advanced packaging, semiconductor testing and optical engine capacity through agreements with six manufacturing partners.

At GTC Berlin, NVIDIA announced in a press release plans to expand substrate, advanced packaging, semiconductor testing and optical engine capacity with six manufacturing partners. Agreements with IBIDEN, Samsung Electro-Mechanics and Unimicron will increase substrate capacity by 2.5 times over the next three years.

Amkor plans to increase interposer wafer capacity in South Korea by more than 300% by the end of 2028. NVIDIA also expects its semiconductor testing capacity to double from 2026 to 2027 through expansions in the United States, Taiwan and Singapore.

NVIDIA will provide KYEC with a $1.1 billion capacity reservation advance for new testing facilities and equipment in the United States, with high volume production targeted for April 2027. SPIL plans to increase Taiwan production capacity for optical engines used in co packaged optics by 15 times by mid 2027, followed by another planned doubling by the end of 2028.

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