Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
IBM and AMD have announced a collaboration with Zyphra to deliver advanced AI infrastructure using AMD Instinct MI300X GPUs on IBM Cloud, as stated in a press release.
SEMIFIVE has received preliminary approval for its KOSDAQ listing, with Samsung Securities and UBS as joint lead underwriters.
OpenAI CEO Sam Altman met with South Korean President Lee Jae-myung to discuss a strategic partnership involving Samsung and SK Group to enhance AI infrastructure and semiconductor collaboration.
Silicom Ltd. has been awarded a Design Win for its FPGA Smart Card, expected to generate $2 million annually, announced in a press release.
Rebellions Inc., a South Korean AI chip startup, has raised $250 million in a Series C funding round, valuing the company at $1.4 billion, according to Bloomberg. The round included participation from Arm Holdings Plc and Samsung Ventures.
ShunYun Technology and NewPhotonics have announced a strategic partnership to manufacture photonic integrated circuits (PICs) at scale, addressing the growing demand for optical interconnect solutions in data centers.
UST and Kaynes Semicon have announced a joint venture to establish a Rs 3,300 crore semiconductor assembly and testing facility in Gujarat, India.
123NET has completed a major expansion of its Southfield DC1 Data Center, enhancing its capabilities for AI and data-intensive applications.
Fourier Cooling Solutions has announced the launch of its scalable, prefabricated data center solutions designed for AI and high-performance computing (HPC) environments.
Gemtek Technology Company Ltd has announced the OMDN-107 800Gbps DR Linear Pluggable Optics transceiver, designed for high-speed optical connectivity in AI and cloud data centers.
TELUS has launched Canada's first fully sovereign AI factory in Rimouski, Quebec, providing advanced AI computing resources while ensuring data sovereignty.
Anode has emerged from stealth with $9 million in seed funding led by Eclipse to accelerate the deployment of its AI-powered mobile microgrids.
Equinix has introduced its Distributed AI infrastructure to support the next wave of AI innovation, including agentic AI, as announced in a press release.
Pantherun Technologies will showcase its new FPGA-based open-source platform, Pepper, at Altera Innovator's Day 2025, marking its official U.S. launch.
Nscale, a UK-based AI data center developer, has raised $1.1 billion in a financing round led by Aker ASA, with participation from Nvidia and Nokia, to expand its infrastructure footprint.
Qualcomm and MediaTek are shifting their competition from smartphones to cloud AI chips, as announced at COMPUTEX 2025. Both companies are joining Nvidia's NVLink Fusion consortium to enhance their positions in the AI infrastructure market.
Hyperscale Data has begun converting its Michigan Data Center to support AI solutions, while maintaining Bitcoin mining operations, announced in a press release.
CoreWeave has expanded its agreement with OpenAI, adding a new $6.5 billion contract to their partnership, bringing the total value to $22.4 billion.
Synopsys and TSMC have announced a collaboration to enhance AI and multi-die design solutions using TSMC's advanced processes and packaging technologies.
The AI chip market is set for a transformation as custom ASICs, advanced packaging, and high-bandwidth memory redefine the landscape, according to a recent report.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
